SK Hynix bolsters AI memory leadership with first HBM4E release
SK Hynix is asserting its leadership in the artificial intelligence (AI) memory market by becoming the first to prepare for the release of the seventh generation of high-bandwidth memory (HBM), HBM4E. The company has already secured key contracts for the supply of customized HBM4E with major technology giants, including Nvidia, Microsoft, and Broadcom, with Nvidia remaining its largest partner.
Despite strong demand from other IT giants, SK Hynix faces the challenge of meeting the entire market demand, as current production capacities do not allow for supplying all leading IT companies (such as Apple, Google, Amazon, Meta, and Tesla) that are actively developing new AI services.
SK Hynix's primary competitor, Samsung, is currently lagging, offering HBM4 (the previous generation) and having yet to secure a contract for the supply of advanced HBM chips with Nvidia.
The market for customized HBM is growing rapidly, with forecasts predicting it to reach $130 billion by 2033. Thanks to early orders from key players, SK Hynix is well-positioned to maintain its dominant standing. A significant change in production is that TSMC will now manufacture the logic dies for HBM due to the necessity of utilizing ultra-precise technologies.
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