Samsung is poised for a significant shift in its strategy as it prepares for the upcoming Galaxy Unpacked event on July 9th. For the first time, Samsung intends to integrate its proprietary Exynos chipsets into two of its three new foldable smartphones: the Galaxy Z Flip7 and the Galaxy Z Flip7 FE. This strategic move extends to models slated for the crucial U.S. market, marking a notable departure. The Flip7 and Flip7 FE will be the inaugural Galaxy foldable devices to feature Exynos chips, and among the limited number of Samsung's flagship phones in the U.S. to operate on their in-house processors.

The Galaxy Z Flip7 is anticipated to be powered by the new 3nm Exynos 2500 processor, while the more budget-friendly Flip7 FE is expected to utilize the Exynos 2400, a chip rumored to also appear in the Galaxy S24 FE. Conversely, the high-end Galaxy Z Fold7 will reportedly continue to employ a Snapdragon processor, likely the Snapdragon 8 Elite, to ensure peak performance.

Initial benchmarks for the Exynos 2500 indicate a substantial performance boost. Furthermore, the Flip7 is expected to feature larger displays, including a 4-inch external screen and a 6.85-inch foldable display.

Samsung has already commenced pre-orders on its website, offering enticing incentives such as up to $1150 for trade-ins and a $50 credit for early registration. Samsung's decision to integrate Exynos into its U.S.-bound foldable models represents a bold strategy aimed at cost reduction and a demonstration of confidence in its proprietary chip technology.

ORIENT